Barrington, RI, United States of America

Adam Hirshan

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Butler Automatic, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Adam Hirshan. Retrieved from https://idiyas.com/inventor/adam-hirshan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: The Innovations of Adam Hirshan

Introduction

Adam Hirshan is an accomplished inventor based in Barrington, Rhode Island. He has made significant contributions to the field of web material splicing, showcasing his expertise through his innovative patent.

Latest Patents

Hirshan holds a patent for a "System and method for aligning and joining the same sides of two web materials." This invention provides a solution for performing a splicing operation where the apparatus is designed to orient the web, ensuring that the two sealing sides are presented to each other. The splice is consistently made on one side of the web, enhancing the efficiency of the splicing process.

Career Highlights

Adam Hirshan is currently employed at Butler Automatic, Inc., where he applies his skills and knowledge to advance the company's technological capabilities. His work has been instrumental in developing innovative solutions that improve manufacturing processes.

Collaborations

Hirshan collaborates with notable colleagues, including Andrew P. Butler and Michael A. Mucci. Their combined expertise fosters a creative environment that drives innovation within the company.

Conclusion

Adam Hirshan's contributions to the field of web material splicing exemplify his dedication to innovation and technology. His patent and work at Butler Automatic, Inc. highlight his role as a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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