Montreal, Canada

Achref Methenni

This inventor holds 3 USPTO granted patents and 58 published patent applications and 1 EPO patent. Top assignee: Interdigital Patent Holdings, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Achref Methenni. Retrieved from https://idiyas.com/inventor/achref-methenni

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

 

Average Co-Inventor Count = 8.1

ph-index = 1


Company Filing History:


Years Active: 2026

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3 patents (USPTO):Explore Patents

Title: Achref Methenni: Innovator in Wireless Systems

Introduction

Achref Methenni is a notable inventor based in Montréal, Canada. He has made significant contributions to the field of wireless systems, particularly in enhancing reliability and fault tolerance.

Latest Patents

Achref holds 1 patent for his invention titled "Network node apparatus and methods for achieving end-to-end reliability and improving fault tolerance in wireless systems." This patent describes a first policy control function (PCF) in a first network node that can receive indications from a session management function (SMF) regarding protocol data unit (PDU) sessions. The invention aims to improve the management of PDU sessions, especially in cases where sessions may experience faults or degraded performance.

Career Highlights

Achref Methenni is currently employed at Interdigital Patent Holdings, Inc., where he continues to innovate in the realm of wireless technology. His work focuses on developing solutions that enhance the performance and reliability of network systems.

Collaborations

Achref collaborates with Rocco Di Girolamo, contributing to advancements in their field through shared expertise and innovative ideas.

Conclusion

Achref Methenni's work exemplifies the spirit of innovation in wireless systems, showcasing his commitment to improving technology for better performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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