Company Filing History:
Years Active: 2021
Title: About Liao
Introduction
About Liao is an innovative inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit packaging, particularly through his patented methods and systems.
Latest Patents
Liao holds a patent for "Methods and systems to perform automated Integrated Fan-Out wafer level package routing." This invention provides a method, system, and non-transitory computer-readable medium for level package routing. The method includes performing triangulation on a set of nets to generate a routing resource graph. The objects of the set of nets are represented by a respective center point during triangulation. The method also includes generating a route between the objects of the set of nets based on at least a total cost. The total cost is determined based on at least the routing resource graph. Additionally, the method includes altering the route based on a determination that a constraint rule is unmet and outputting routing information comprising the route for the set of nets. Liao has 1 patent to his name.
Career Highlights
Liao is currently employed at Synopsys, Inc., a leading company in electronic design automation. His work focuses on enhancing the efficiency and effectiveness of integrated circuit design and packaging.
Collaborations
Liao collaborates with talented coworkers, including Bing Chen and Happy Wang. Their combined expertise contributes to the innovative projects at Synopsys, Inc.
Conclusion
About Liao is a notable inventor whose work in automated integrated circuit packaging has the potential to advance the industry significantly. His contributions reflect a commitment to innovation and excellence in technology.