This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Applied Materials, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Abhishek Kumar Verma: Innovator in Electrostatic Chuck Technology
Introduction
Abhishek Kumar Verma is a notable inventor based in Santa Clara, CA. He has made significant contributions to the field of semiconductor manufacturing through his innovative designs and technologies. His work primarily focuses on enhancing substrate support assemblies, which are crucial in various manufacturing processes.
Latest Patents
Abhishek holds a patent for a "Bipolar electrostatic chuck electrode with self-induced DC voltage." This invention involves substrate support assemblies that include an electrostatic chuck body defining a substrate support surface. The assemblies feature a support stem coupled with the electrostatic chuck body, along with a first bipolar electrode embedded within the chuck body. Additionally, a second bipolar electrode is embedded radially inward of the first, and an annular electrode is disposed about the first bipolar electrode, which is DC floated and RF powered, exhibiting an induced DC current. This innovative design enhances the efficiency and effectiveness of substrate support in semiconductor applications.
Career Highlights
Abhishek Kumar Verma is currently associated with Applied Materials, Inc., a leading company in the semiconductor equipment industry. His role involves developing advanced technologies that improve manufacturing processes and product quality. His expertise in electrostatic chuck technology has positioned him as a valuable asset in the field.
Collaborations
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Conclusion
Abhishek Kumar Verma's contributions to electrostatic chuck technology demonstrate his innovative spirit and commitment to advancing semiconductor manufacturing. His patent reflects a significant step forward in the efficiency of substrate support assemblies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
