Anyang, South Korea

A Reum Lee

This inventor holds 6 USPTO granted patents and 8 published patent applications. Top assignees: Orion Corporation, Fust Lab. Co., Ltd.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: A Reum Lee. Retrieved from https://idiyas.com/inventor/a-reum-lee-p4e3az5w

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2024-2026

Loading Chart...
6 patents (USPTO):Explore Patents

Title: A Reum Lee: Innovator in Packaging Solutions

Introduction

A Reum Lee is a notable inventor based in Anyang, South Korea. He has made significant contributions to the field of packaging, holding a total of 6 patents. His innovative ideas have helped shape the industry and improve packaging solutions.

Latest Patents

Among his latest patents, A Reum Lee has focused on advancements in packaging technology. His work has been instrumental in developing new methods and materials that enhance the efficiency and sustainability of packaging.

Career Highlights

A Reum Lee has worked with prominent companies such as Orion Corporation and Fust Lab Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, A Reum Lee has collaborated with talented individuals, including Hyun A Lee and Su Been Noh. These partnerships have fostered creativity and led to the development of groundbreaking packaging solutions.

Conclusion

A Reum Lee's contributions to the packaging industry demonstrate his commitment to innovation and excellence. His patents and collaborations reflect his dedication to improving packaging technology for a better future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…