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Wrocław, Poland

Xtpl S.a.

USPTO Granted Patents = 24

EPO Patents = 2

Forward Citations = 2

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33 inventors (with patents filed for the assignee):

Filip Granek (23 out of 23 patents)

Piotr Kowalczewski (13 out of 13 patents)

Aneta Wiatrowska (11 out of 13 patents)

4. Maciej Tybel (6 out of 6 patents)

5. Łukasz Witczak (5 out of 5 patents)

6. Szymon Zięba (5 out of 5 patents)

7. Michal Dusza (4 out of 4 patents)

8. Karolina Fia̧czyk (4 out of 4 patents)

9. Jolanta Gadzalińska (4 out of 4 patents)

10. Ludovic Schneider (3 out of 3 patents)

11. Lukasz Witczak (3 out of 3 patents)

12. Mateusz Lysień (2 out of 2 patents)

13. Krzysztof Fijak (2 out of 2 patents)

14. Przemyslaw Cichon (2 out of 2 patents)

15. Mateusz Lysien (2 out of 2 patents)

24 patents: Sort by Forward Citations

1. 12752484 - Method for additive manufacturing and an additive manufacturing apparatus (2026-10-06),

2. 12577423 - Metallic nanoparticle composition and method of dispensing metallic nanoparticle composition (2026-03-17),

3. 12434297 - Methods of extruding a nanoparticle composition onto a substrate (2025-10-07),

4. 12285898 - Metallic nanoparticle composition dispenser and method of dispensing metallic nanoparticle composition (2025-04-29),

5. 12253537 - Method of measuring a minimum pressure for gas bubble generation of a capillary tube, and related methods (2025-03-18),

6. 12202279 - Methods of detecting and adjusting contact of a micro-structural fluid ejector to a substrate and method of detecting a fault condition in fluid flow from a micro-structural fluid ejector onto a substrate (2025-01-21),

7. 12128477 - Additive method of forming a metallic nanoparticle microdot on a substrate, a metallic nanoparticle microdot, and an elongate metallic nanoparticle feature (2024-10-29),

8. 12105012 - Method of detecting surface irregularities on or in an internal surface of a cylinder for use in a piston-cylinder assembly, and related apparatus (2024-10-01),

9. 12101893 - Methods of dispensing a metallic nanoparticle composition from a nozzle onto a substrate (2024-09-24),

10. 12082347 - Method for printing traces on a substrate and an additive manufacturing apparatus therefor (2024-09-03),

11. 12073962 - Method of forming a transparent conductive member, and a free-standing transparent conductive film (2024-08-27),

12. 12033862 - Method of forming an electrically conductive feature traversing a microscopic step and related apparatus (2024-07-09),

13. 11987049 - Method of forming a feature by dispensing a metallic nanoparticle composition from an ink-jet print head and a metallic nanoparticle composition for ink-jet printing (2024-05-21),

14. 11931935 - Method of filling a microcavity with layers of polymeric material (2024-03-19),

15. 11911814 - Method of forming an elongate electrical connection feature traversing a microscopic step (2024-02-27),

Company Overview

Xtpl S.a., based in Wrocław, Poland, specializes in advanced materials and innovative printing technologies. The company focuses on developing solutions for the electronics and photonics sectors, particularly through its proprietary technology that enables the production of high-resolution, functional materials. Xtpl's research emphasizes enhancing the performance and efficiency of electronic devices, making significant contributions to the fields of printed electronics and optoelectronics.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

24 Patents

#1 in Wrocław

#11 in Poland

#26,628 in the World

Wrocław, Poland

Xtpl S.a.

Forward Citations = 2

33 inventors:

Filip Granek (23 out of 23 patents)

Piotr Kowalczewski (13 out of 13 patents)

Aneta Wiatrowska (11 out of 13 patents)

4. Maciej Tybel (6 out of 6 patents)

5. Łukasz Witczak (5 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Xtpl S.a.. Retrieved from https://idiyas.com/company/xtpl-s-a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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