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For the Inventor, By the Inventor

Dublin, Ireland

X-celeprint Limited


USPTO Granted Patents = 169


Trademarks = 1

Forward Citations = 3,117

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70 inventors (with patents filed for the assignee):

goldMedal Ronald S Cok (109 out of 670 patents)

silverMedal Christopher Andrew Bower (102 out of 223 patents)

bronzeMedal Matthew Alexander Meitl (91 out of 215 patents)

4.  Robert R Rotzoll (24 out of 82 patents)

5.  Salvatore Bonafede (22 out of 47 patents)

6.  António José Marques Trindade (21 out of 31 patents)

7.  David Julian Gomez (21 out of 46 patents)

8.  Carl Prevatte (19 out of 31 patents)

9.  David Kneeburg (12 out of 17 patents)

10.  Alin Mihai Fecioru (11 out of 15 patents)

11.  Etienne Menard (10 out of 66 patents)

12.  Raja Fazan Gul (9 out of 14 patents)

13.  Joseph Carr (9 out of 18 patents)

14.  Brook David Raymond (7 out of 36 patents)

15.  Carl Ray Prevatte, Jr (5 out of 15 patents)


Core Competencies:
Variable Stiffness Modules
Micro-Device Structures
Transfer Printing Stamps
Piezoelectric Power Components
Flexible Electronic Structures
Printed Components
Optical Systems
Micro-Transfer-Printed Devices
Secure Integrated-Circuit Systems
Magnetic Field Sensors
Printable 3D Electronic Components
Non-Linear Tethers

169 patents:

1. 12494367 - Printing components to substrate posts with gaps (2025-12-09),
2. 12456706 - Variable stiffness modules (2025-10-28),
3. 12448283 - Micro-device structures with etch holes (2025-10-21),
4. 12438015 - Stamps with structured microposts (2025-10-07),
5. 12437174 - Hybrid documents with electronic indicia (2025-10-07),
6. 12420543 - Transfer printing stamps and methods of stamp delamination (2025-09-23),
7. 12414471 - Piezoelectric power components (2025-09-09),
8. 12398031 - Micro-device structures with etch holes (2025-08-26),
9. 12396101 - Flexible electronic structures (2025-08-19),
10. 12394657 - Transfer printing stamps and methods of stamp delamination (2025-08-19),
11. 12389544 - Method of making a stacked electronic component (2025-08-12),
12. RE50432 - Antenna with micro-transfer-printed circuit element (2025-05-13),
13. 12237443 - Printed components in device pockets (2025-02-25),
14. 12237310 - Disaggregated transistor devices (2025-02-25),
15. 12218415 - Antenna encapsulation (2025-02-04),
X-Celeprint Limited is a technology company specializing in advanced micro-assembly process solutions for printed electronics and 3D micro manufacturing. They provide innovative technologies and services that enable high-precision, mass customization, and miniaturization of various products. With their unique micro-transfer printing technology, X-Celeprint offers cost-effective solutions for electronic packaging, device integration, and complex 3D micro assembly.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

169 Patents

#11 in Dublin

#15 in Ireland

#4,753 in the World

...
Dublin, Ireland

X-celeprint Limited

Forward Citations = 3,117

70 inventors:

goldMedal Ronald S Cok (109 out of 670 patents)

silverMedal Christopher Andrew Bower (102 out of 223 patents)

bronzeMedal Matthew Alexander Meitl (91 out of 215 patents)

4.  Robert R Rotzoll (24 out of 82 patents)

5.  Salvatore Bonafede (22 out of 47 patents)

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