The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 28, 2025

Filed:

Aug. 24, 2020
Applicants:

X-celeprint Limited, Dublin, IE;

Leonhard Kurz Stiftung & Co. KG, Fürth, DE;

Inventors:

Ronald S. Cok, Rochester, NY (US);

Gabriele Roithmeier, Nuremberg, DE;

Christian Schulz, Fürth, DE;

Michael Scharfenberg, Nuremberg, DE;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 24/40 (2013.01); H01L 21/4857 (2013.01); H01L 23/49833 (2013.01); H01L 23/4985 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 24/24 (2013.01); H01L 24/72 (2013.01); H01L 25/0655 (2013.01); H01L 25/167 (2013.01); H05K 1/0271 (2013.01); H05K 1/0274 (2013.01); H05K 1/189 (2013.01); H05K 3/301 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40228 (2013.01);
Abstract

A variable-stiffness module includes a rigid structure having a first stiffness, an intermediate substrate having a second stiffness less than the first stiffness, and a flexible substrate having a third stiffness less than the second stiffness. The rigid structure is disposed on the intermediate substrate and the intermediate substrate is disposed on the flexible substrate. A conductor is disposed partially on the intermediate substrate and partially on the flexible substrate and is connected to the rigid structure. The conductor extends from the rigid structure to the intermediate substrate to the flexible substrate. In some embodiments, a variable-stiffness module includes any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor can be an optical conductor or an electrical conductor and can be disposed over the rigid structure or between the rigid structure and the intermediate substrate.


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