For the Inventor, By the Inventor

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Wuhan Neuracom Technology Development Co., Ltd.

USPTO Granted Patents = 4

Forward Citations = 0

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9 inventors (with patents filed for the assignee):

Li Huang (4 out of 7 patents)

Cheng Huang (4 out of 6 patents)

Bei Tong (2 out of 2 patents)

4. Chao Wang (1 out of 25 patents)

5. Kai Li (1 out of 1 patent)

6. Jianfei Gao (1 out of 1 patent)

7. Chunshui Wang (1 out of 1 patent)

8. Moutao Li (1 out of 1 patent)

9. Guangyan Cai (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 12434315 - Reverse soldering connection structure of microneedle and wiring and preparation process therefor (2025-10-07),

2. 12390163 - Composite microneedle structure based on integrated circuit chip (2025-08-19),

3. 12311138 - Area array micro-needle structure (2025-05-27),

4. 12263001 - Neural interface circuit for bidirectional signal transmission (2025-04-01),

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USPTO Data Jan 1 1976 - Dec 9 2025

4 Patents

#60 in Wuhan

#5,549 in China

Wuhan Neuracom Technology Development Co., Ltd.

Forward Citations = 0

9 inventors:

Li Huang (4 out of 7 patents)

Cheng Huang (4 out of 6 patents)

Bei Tong (2 out of 2 patents)

4. Chao Wang (1 out of 25 patents)

5. Kai Li (1 out of 1 patent)

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