The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Nov. 21, 2024
Applicant:
Wuhan Neuracom Technology Development Co., Ltd., Wuhan, CN;
Inventors:
Li Huang, Wuhan, CN;
Cheng Huang, Wuhan, CN;
Guangyan Cai, Wuhan, CN;
Jianfei Gao, Wuhan, CN;
Chunshui Wang, Wuhan, CN;
Chao Wang, Wuhan, CN;
Assignee:
WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD., Wuhan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 2101/36 (2018.08);
Abstract
Disclosed are a reverse soldering connection structure of a microneedle and a wiring and a preparation process thereof. The reverse soldering metal layer of the microneedle is prepared; the reverse soldering metal layer of the wiring is prepared; the reverse soldering metal layer of the microneedle is aligned with the reverse soldering metal layer of the wiring, and they will be pressed to achieve reverse soldering connection between the microneedle and the wiring.