Forward Citations = 170

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5 inventors (with patents filed for the assignee):

David C H Cheng (3 out of 16 patents)

Chih-Peng Fan (1 out of 12 patents)

Chih-Hao Yeh (1 out of 1 patent)

4. Chang-Chin Hsieh (1 out of 3 patents)

5. Jao-Chin Cheng (1 out of 8 patents)

4 patents: Sort by Forward Citations

1. 6749737 - Method of fabricating inter-layer solid conductive rods (2004-06-15),

2. 6638858 - Hole metal-filling method (2003-10-28),

3. 6353999 - Method of making mechanical-laser structure (2002-03-12),

4. 6210746 - Method of fabricating a solder resist mask (2001-04-03),

Unimicron Taiwan Corp. is a leading global provider of advanced electronic packaging and substrate solutions. With a focus on innovation, quality, and customer satisfaction, Unimicron provides high-quality products and services to a diverse range of industries, including consumer electronics, telecommunications, automotive, and more. Partnering with some of the world's leading technology companies, Unimicron is committed to delivering cutting-edge solutions to meet the evolving needs of the electronics industry.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

4 Patents

#10 in Taoyuan Hsien

#2,621 in Taiwan

Taoyuan Hsien, Taiwan

Unimicron Taiwan Corp.