Forward Citations = 15

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4 inventors (with patents filed for the assignee):

Andreas Jakob (2 out of 5 patents)

Franz Richter (2 out of 4 patents)

Volkmar Stenzel (1 out of 6 patents)

4. Klaus-D Vissing (1 out of 3 patents)

4 patents: Sort by Forward Citations

1. 8951886 - Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front (2015-02-10),

2. 8911583 - Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement (2014-12-16),

3. 8641859 - Bonding method (2014-02-04),

4. 8173522 - Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer (2012-05-08),

Thin Materials Ag specializes in the development and production of cutting-edge thin materials for various industries. With a focus on innovation and sustainability, we provide high-quality, environmentally-friendly solutions that meet the needs of our customers. Our products are used in electronics, packaging, healthcare, and other sectors where thin, lightweight materials are essential. Visit our website to learn more about our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

4 Patents

#2 in Eichenau

#6,920 in Germany

Eichenau, Germany

Thin Materials Ag

Forward Citations = 15

4 inventors:

Andreas Jakob (2 out of 5 patents)

Franz Richter (2 out of 4 patents)

Volkmar Stenzel (1 out of 6 patents)

4. Klaus-D Vissing (1 out of 3 patents)

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