% Expired Patents = 25.0

Forward Citations = 19

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4 inventors (with patents filed for the assignee):

Andreas Jakob (2 out of 5 patents)

Franz Richter (2 out of 4 patents)

Volkmar Stenzel (1 out of 6 patents)

4. Klaus-D Vissing (1 out of 3 patents)

4 patents: Sort by Forward Citations

1. 8951886 - Method for separating a layer system comprising a wafer by precisely maintaining the position of the separating front (2015-02-10),

2. 8911583 - Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement (2014-12-16),

3. 8641859 - Bonding method (2014-02-04),

4. 8173522 - Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer (2012-05-08),

Company Overview

Thin Materials Ag specializes in the development and production of cutting-edge thin materials for various industries. With a focus on innovation and sustainability, we provide high-quality, environmentally-friendly solutions that meet the needs of our customers. Our products are used in electronics, packaging, healthcare, and other sectors where thin, lightweight materials are essential. Visit our website to learn more about our products and services.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

4 Patents

#2 in Eichenau

#7,032 in Germany

Eichenau, Germany

Thin Materials Ag

Forward Citations = 19

4 inventors:

Andreas Jakob (2 out of 5 patents)

Franz Richter (2 out of 4 patents)

Volkmar Stenzel (1 out of 6 patents)

4. Klaus-D Vissing (1 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Thin Materials Ag. Retrieved from https://idiyas.com/company/thin-materials-ag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]