For the Inventor, By the Inventor

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Dallas, TX, United States of America

Thermalloy, Inc.

Calculating rank

USPTO Granted Patents = 74

Forward Citations = 1,425

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23 inventors (with patents filed for the assignee):

Donald L Clemens (25 out of 28 patents)

Matthew C Smithers (20 out of 23 patents)

William D Jordan (17 out of 21 patents)

4. Howard G Hinshaw (15 out of 15 patents)

5. Marvin F Moore (11 out of 11 patents)

6. James D Pritchett (4 out of 8 patents)

7. Steven F Edwards (4 out of 5 patents)

8. Leonard S Breese (4 out of 4 patents)

9. Donald L Bland (3 out of 3 patents)

10. Keith R Moulton (2 out of 2 patents)

11. Gary F Kuzmin (2 out of 3 patents)

12. Roger C Hundt (2 out of 2 patents)

13. Larry D Marshall (2 out of 2 patents)

14. David H Kennington (2 out of 2 patents)

15. Kon Mang Lin (1 out of 3 patents)

Core Competencies:

Heat Sink

Thermal Management

Attachment Assembly

Electronic Device Package

Mounting Apparatus

Fan Attachment Clip

Spring Clip Fastener

Insulating Apparatus

Solderable Fastener

Heat Dissipation System

Surface Mount

Packaging Devices

74 patents: Sort by Forward Citations

1. 6313993 - Strap spring for attaching heat sinks to circuit boards (2001-11-06),

2. 6195880 - Strap spring for attaching heat sinks to circuit boards (2001-03-06),

3. 6143076 - Applicator head (2000-11-07),

4. 6118657 - Fan attachment clip for heat sink (2000-09-12),

5. 6115253 - Strap spring for heat sink clip assembly (2000-09-05),

6. 6097603 - Heat sink for direct attachment to surface mount electronic device (2000-08-01),

7. 6082440 - Heat dissipation system having releasable attachment assembly (2000-07-04),

8. 6059116 - Heat sink packaging devices (2000-05-09),

9. 5991154 - Attachment of electronic device packages to heat sinks (1999-11-23),

10. 5930114 - Heat sink mounting assembly for surface mount electronic device packages (1999-07-27),

11. 5917700 - Heat sink and attachment process for electronic components (1999-06-29),

12. 5897917 - Pre-application of grease to heat sinks with a protective coating (1999-04-27),

13. 5889653 - Strap spring for heat sink clip assembly (1999-03-30),

14. 5847928 - Strap spring for attaching heat sinks to circuit boards (1998-12-08),

15. 5844312 - Solderable transistor clip and heat sink (1998-12-01),

Company Overview

Thermalloy, Inc. is a leading provider of advanced heat sink technology, specializing in thermal management solutions for electronic devices. Based in Dallas, TX, the company focuses on the development and manufacturing of innovative products such as heat sinks, attachment assemblies, and mounting apparatuses. Their expertise extends to fan attachment clips, spring clip fasteners, and insulating apparatuses, ensuring efficient thermal performance in various applications. Thermalloy is committed to enhancing the reliability and longevity of electronic systems through effective thermal solutions.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

74 Patents

#28 in Dallas, TX

#268 in Texas

#4,983 in US

#10,144 in the World

Dallas, TX, United States of America

Thermalloy, Inc.

Forward Citations = 1,425

23 inventors:

Donald L Clemens (25 out of 28 patents)

Matthew C Smithers (20 out of 23 patents)

William D Jordan (17 out of 21 patents)

4. Howard G Hinshaw (15 out of 15 patents)

5. Marvin F Moore (11 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Thermalloy, Inc.. Retrieved from https://idiyas.com/company/thermalloy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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