Forward Citations = 228

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7 inventors (with patents filed for the assignee):

James D Gowan (2 out of 6 patents)

Gerald C Calleson (2 out of 2 patents)

Qi Wang (1 out of 23 patents)

4. Donald W Mathews (1 out of 2 patents)

5. Harvey Creamer (1 out of 1 patent)

6. Lionel J LeJeune, Iii (1 out of 1 patent)

7. Peter M Watson (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 5941303 - Extruded manifold with multiple passages and cross-counterflow heat (1999-08-24),

2. 5934366 - Manifold for heat exchanger incorporating baffles, end caps, and brackets (1999-08-10),

3. 5152339 - Manifold assembly for a parallel flow heat exchanger (1992-10-06),

4. 5125454 - Manifold assembly for a parallel flow heat exchanger (1992-06-30),

5. 5107926 - Manifold assembly for a parallel flow heat exchanger (1992-04-28),

Company Overview

Thermal Components, Inc. is a leading manufacturer of high-quality thermal and temperature control components for industrial applications. With over 20 years of experience, we provide innovative solutions to meet our customers' diverse needs. Our products include sensors, heaters, controllers, and custom thermal solutions. We are committed to delivering reliable and efficient products to help our clients excel in their industries.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

5 Patents

#11 in Montgomery, AL

#244 in Alabama

#51,620 in US

Montgomery, AL, United States of America

Thermal Components, Inc.

Forward Citations = 228

7 inventors:

James D Gowan (2 out of 6 patents)

Gerald C Calleson (2 out of 2 patents)

Qi Wang (1 out of 23 patents)

4. Donald W Mathews (1 out of 2 patents)

5. Harvey Creamer (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Thermal Components, Inc.. Retrieved from https://idiyas.com/company/thermal-components

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]