Trademarks = 3

Forward Citations = 259

Loading Chart...

2 inventors (with patents filed for the assignee):

Jayna Sheats (4 out of 14 patents)

Yun Uhm (1 out of 10 patents)

4 patents: Sort by Forward Citations

1. 9406644 - Chip separation process for photochemical component printing (2016-08-02),

2. 8759713 - Methods for interconnecting bonding pads between components (2014-06-24),

3. 8153517 - Processes and structures for IC fabrication (2012-04-10),

4. 8124452 - Processes and structures for IC fabrication (2012-02-28),

Terepac Corporation is a technology company specializing in the development of miniaturized sensors and microelectronics. They offer advanced solutions for various industries including healthcare, automotive, and consumer electronics. Terepac's innovative products enable real-time data collection and analysis, leading to improved efficiency and decision-making for their clients.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

4 Patents

#73 in Waterloo

#3,376 in Canada

Waterloo, Canada

Terepac Corporation

Forward Citations = 259

2 inventors:

Jayna Sheats (4 out of 14 patents)

Yun Uhm (1 out of 10 patents)

Please report any incorrect information to support@idiyas.com