For the Inventor, By the Inventor

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Evanston, IL, United States of America

Tenneo Packaging

USPTO Granted Patents = 1

Forward Citations = 50

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4 inventors (with patents filed for the assignee):

Wen Pao Wu (1 out of 21 patents)

Gary R DelDuca (1 out of 16 patents)

Alan E Deyo (1 out of 15 patents)

4. Vinod K Luthra (1 out of 17 patents)

1 patent: Sort by Forward Citations

1. 5811142 - Modified atmosphere package for cut of raw meat (1998-09-22),

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USPTO Data Jan 1 1976 - Dec 16 2025

1 Patents

#88 in Evanston, IL

#6,096 in Illinois

#133,784 in US

Evanston, IL, United States of America

Tenneo Packaging

Forward Citations = 50

4 inventors:

Wen Pao Wu (1 out of 21 patents)

Gary R DelDuca (1 out of 16 patents)

Alan E Deyo (1 out of 15 patents)

4. Vinod K Luthra (1 out of 17 patents)

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