Forward Citations = 59

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8 inventors (with patents filed for the assignee):

Joram Diamant (5 out of 7 patents)

Henry L Myers (3 out of 3 patents)

Philip J Breeden (2 out of 2 patents)

4. Adam J Bell (2 out of 2 patents)

5. Edmund S Lewandowski (2 out of 2 patents)

6. Shinbo Makoto (1 out of 1 patent)

7. Hagimo Akihiro (1 out of 1 patent)

8. Asami Hiromi (1 out of 1 patent)

6 patents: Sort by Forward Citations

1. 5989362 - Polymerizable flux composition for encapsulating the solder in situ (1999-11-23),

2. 5851311 - Polymerizable flux composition for encapsulating the solder in situ (1998-12-22),

3. 5514729 - Ultraviolet hardenable, solventless electrically conductive polymeric (1996-05-07),

4. 5449407 - Expansion compensated precision extrusion apparatus (1995-09-12),

5. 5376414 - Expansion compensated precision extrusion method (1994-12-27),

6. D350123 - In-circuit emulator (1994-08-30),

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USPTO Data Jan 1 1976 - Dec 30 2025

6 Patents

#269 in

#5,843 in Japan

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