For the Inventor, By the Inventor

Enter assignee name

Sii P & S Inc.

USPTO Granted Patents = 13

% Expired Patents = 84.6

Forward Citations = 88

Loading Chart...

Loading Chart...

13 inventors (with patents filed for the assignee):

Shinichi Yoshida (9 out of 21 patents)

Minoru Hoshino (7 out of 33 patents)

Yoshinori Sato (7 out of 100 patents)

4. Norimitsu Sambongi (3 out of 8 patents)

5. Masanori Takahashi (2 out of 67 patents)

6. Takanori Okayasu (2 out of 4 patents)

7. Akihiko Ito (2 out of 16 patents)

8. Takumi Seino (1 out of 9 patents)

9. Yuji Nakamura (1 out of 10 patents)

10. Seiichi Jimbo (1 out of 6 patents)

11. Shinji Nureki (1 out of 10 patents)

12. Saburo Imai (1 out of 6 patents)

13. Saburou Imai (1 out of 1 patent)

13 patents: Sort by Forward Citations

1. 7002612 - Paper cutter and thermal printer (2006-02-21),

2. 6947066 - Thermal activating device of thermal activation sheet and printer using the thermal activating device (2005-09-20),

3. 6885390 - Thermally activating apparatus of thermosensible adhering sheet and printer apparatus (2005-04-26),

4. 6877917 - Printer apparatus for thermosensitive adhesive sheet (2005-04-12),

5. 6875955 - Thermal activation device for heat-sensitive self-adhesive sheet and a printer assembly (2005-04-05),

6. 6867792 - Forwarding and cutting method of heat sensitive adhesive sheet and printer for heat sensitive adhesive sheet (2005-03-15),

7. 6863104 - Thermally activating apparatus and printer for heat-sensitive adhesive sheet (2005-03-08),

8. 6850262 - Thermal activation device for heat-sensitive self-adhesive sheet and a printer assembly employing the same (2005-02-01),

9. 6812944 - Thermal head (2004-11-02),

10. 6795103 - Thermal printer having thermally activating apparatus for heat-sensitive adhesive sheet (2004-09-21),

11. 6786125 - Cutter device for a printer (2004-09-07),

12. 6784910 - Thermal head, thermal activation device for thermally active sheet and printer assembly (2004-08-31),

13. 6744457 - Thermal printer (2004-06-01),

Company Overview

Sii P & S Inc., based in Chiba, Japan, specializes in the development and manufacturing of advanced electronic components and systems. The company focuses on providing innovative solutions in the fields of industrial automation, telecommunications, and consumer electronics. With a commitment to research and development, Sii P & S Inc. aims to enhance the functionality and efficiency of electronic devices, catering to a diverse range of industries and applications. Their expertise positions them as a key player in the evolving technology landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

13 Patents

#47 in Chiba

#3,752 in Japan

#45,081 in the World

Sii P & S Inc.

Forward Citations = 88

13 inventors:

Shinichi Yoshida (9 out of 21 patents)

Minoru Hoshino (7 out of 33 patents)

Yoshinori Sato (7 out of 100 patents)

4. Norimitsu Sambongi (3 out of 8 patents)

5. Masanori Takahashi (2 out of 67 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sii P & S Inc.. Retrieved from https://idiyas.com/company/sii-p-and-s

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…