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For the Inventor, By the Inventor

Gwangju-si, South Korea

Sigo Co., Ltd.


USPTO Granted Patents = 2

Forward Citations = 0

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1 inventor (with patents filed for the assignee):

goldMedal Sung Chul Kim (2 out of 38 patents)


2 patents:

1. 7598729 - Semiconductor chip flipping assembly and apparatus for bonding semiconductor chip using the same (2009-10-06),
2. 7534703 - Method for bonding semiconductor chip (2009-05-19),
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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#8 in Gwangju-si

#3,609 in South Korea

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Gwangju-si, South Korea

Sigo Co., Ltd.

Forward Citations = 0

1 inventor:

goldMedal Sung Chul Kim (2 out of 38 patents)

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