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For the Inventor, By the Inventor

Suffern, NY, United States of America

Seed Layers Technology, LLC


USPTO Granted Patents = 1

Forward Citations = 0

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1 inventor (with patents filed for the assignee):

goldMedal Uri Cohen (1 out of 49 patents)


1 patent:

1. 8123861 - Apparatus for making interconnect seed layers and products (2012-02-28),
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USPTO Data Jan 1 1976 - Dec 30 2025

1 Patents

#21 in Suffern, NY

#8,402 in New York

#133,919 in US

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Suffern, NY, United States of America

Seed Layers Technology, LLC

Forward Citations = 0

1 inventor:

goldMedal Uri Cohen (1 out of 49 patents)

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