Company Badge
USPTO Data Jan 1 1976 - Oct 20 2026
28 Patents
#2 in Bedford Park, IL
#642 in Illinois
#12,016 in US
#23,299 in the World
Prairie Packaging, Inc.
Forward Citations = 667
4 inventors:
Bedford Park, IL, United States of America
Prairie Packaging, Inc.
% Expired Patents = 25.0
Trademarks = 3
Forward Citations = 667
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4 inventors (with patents filed for the assignee):
Robert W Hollis (26 out of 34 patents)
Weston S Koennecke (19 out of 50 patents)
John R Geer, Iii (17 out of 19 patents)
4. Dimitri Stamatiou (9 out of 12 patents)
Core Competencies:
Reinforced Foam Cup
Disposable Cup Lid
Flatware Handle
Manufacturing Method
Plastic Foam
Cup Design
Packaging Solutions
Thermal Insulation
28 patents:
2. 7918016 - Reinforced plastic foam cup, method of and apparatus for manufacturing same (2011-04-05),
6. 7814647 - Reinforced plastic foam cup, method of and apparatus for manufacturing same (2010-10-19),
8. 7704347 - Reinforced plastic foam cup, method of and apparatus for manufacturing same (2010-04-27),
9. 7694843 - Reinforced plastic foam cup, method of and apparatus for manufacturing same (2010-04-13),
Company Overview
Prairie Packaging, Inc. is a prominent manufacturer specializing in innovative packaging solutions tailored for various industries. Based in Bedford Park, Illinois, the company focuses on developing sustainable and efficient packaging technologies that meet the evolving needs of its clients. With a commitment to quality and environmental responsibility, Prairie Packaging offers a range of products designed to enhance product protection and shelf appeal while minimizing ecological impact. Their expertise spans multiple sectors, ensuring versatile applications of their packaging solutions.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Prairie Packaging, Inc.. Retrieved from https://idiyas.com/company/prairie-packaging
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]