CIPO Patents = 1

Trademarks = 1

Forward Citations = 6

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6 inventors (with patents filed for the assignee):

Takeo Igarashi (1 out of 5 patents)

Tadashi Sawamura (1 out of 5 patents)

Yukio Maeda (1 out of 3 patents)

4. Kazuhiko Kaneko (1 out of 3 patents)

5. Toranosuke Kawaguchi (1 out of 1 patent)

6. Akikazu Maezono (1 out of 1 patent)

7. Hisashi Komiya (2 patents)

8. Tsuguo Inazawa (0 patent)

9. Fujio Nakagawa (0 patent)

2 patents: Sort by Forward Citations

1. 10010979 - Solder paste for bonding micro components (2018-07-03),

2. 5778964 - Solid spherical body manufacturing apparatus (1998-07-14),

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

2 Patents

#4,372 in Tokyo

#11,139 in Japan

Tokyo, Japan

Nihon Almit Co., Ltd.

Forward Citations = 6

6 inventors:

Takeo Igarashi (1 out of 5 patents)

Tadashi Sawamura (1 out of 5 patents)

Yukio Maeda (1 out of 3 patents)

4. Kazuhiko Kaneko (1 out of 3 patents)

5. Toranosuke Kawaguchi (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nihon Almit Co., Ltd.. Retrieved from https://idiyas.com/company/nihon-almit-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent (CIPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]