Lewis Center, OH, United States of America

Nextech Materials, Ltd.


USPTO Granted Patents = 17

% Expired Patents = 52.9


Trademarks = 1

Forward Citations = 104

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18 inventors (with patents filed for the assignee):

goldMedal Scott Lawrence Swartz (13 out of 24 patents)

silverMedal Matthew M Seabaugh (13 out of 16 patents)

bronzeMedal Michael J Day (9 out of 10 patents)

4.  Buddy E McCormick (4 out of 4 patents)

5.  Paul H Matter (3 out of 11 patents)

6.  William John Dawson (3 out of 7 patents)

7.  Lora B Thrun (3 out of 4 patents)

8.  Katarzyna Sabolsky (3 out of 3 patents)

9.  Christopher T Holt (2 out of 9 patents)

10.  Jared R Archer (2 out of 2 patents)

11.  Gene B Arkenberg (2 out of 2 patents)

12.  Todd G Lesousky (2 out of 2 patents)

13.  Stephen R Cummings (1 out of 1 patent)

14.  Chad T Sellers (1 out of 1 patent)

15.  Edward M Sabolsky (1 out of 1 patent)


17 patents:

Company Overview
Nextech Materials, Ltd. is a technology-driven company based in Lewis Center, Ohio, specializing in advanced materials for various applications. The organization focuses on the development and manufacturing of innovative materials that enhance performance in industries such as electronics, energy, and automotive. With a commitment to research and development, Nextech aims to provide cutting-edge solutions that meet the evolving needs of its clients, leveraging expertise in material science and engineering to drive progress in technology.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

17 Patents

#1 in Lewis Center, OH

#807 in Ohio

#18,894 in US

#35,918 in the World

Lewis Center, OH (US)
Lewis Center, OH, United States of America
Forward Citations = 104

18 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nextech Materials, Ltd.. Retrieved from https://idiyas.com/company/nextech-materials

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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