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For the Inventor, By the Inventor

Brunei Darussalam, undefined

Neobule Technologies, Inc.


USPTO Granted Patents = 1

% Expired Patents = 100.0

Forward Citations = 4

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1 inventor (with patents filed for the assignee):

goldMedal Jen-Shyan Chen (1 out of 42 patents)


1 patent:

1. 7786490 - Multi-chip module single package structure for semiconductor (2010-08-31),
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USPTO Data Jan 1 1976 - Sep 15 2026

1 Patents

#1 in Brunei Darussalam

#7 in unknown

Brunei Darussalam, unknown
Brunei Darussalam, undefined

Neobule Technologies, Inc.

Forward Citations = 4

1 inventor:

goldMedal Jen-Shyan Chen (1 out of 42 patents)

Please report any incorrect information to [email protected]
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