Company Badge
USPTO Data Jan 1 1976 - Oct 6 2026
5 Patents
#22 in Lincolnshire, IL
#2,422 in Illinois
#51,570 in US
Mlp U.s.a., Inc.
Forward Citations = 4
5 inventors:
Lincolnshire, IL, United States of America
Mlp U.s.a., Inc.
% Expired Patents = 100.0
Forward Citations = 4
Loading Chart...
Loading Chart...
5 inventors (with patents filed for the assignee):
Joseph L Byers (5 out of 18 patents)
Leslie Scott Hix (5 out of 5 patents)
Michael F Stock (5 out of 5 patents)
4. Timothy F Badowski (4 out of 4 patents)
5. Timothy F Badowaki (1 out of 1 patent)
5 patents:
1. 7530306 - Offset lithographic printing press having seamed sleeved printing blanket (2009-05-12),
2. 7287470 - Offset lithographic printing press having seamed sleeved printing blanket (2007-10-30),
Company Overview
MLP U.S.A., Inc. is a leading provider of innovative packaging solutions for the beauty and personal care industry. With a focus on sustainability and cutting-edge technology, MLP U.S.A., Inc. offers a wide range of packaging options to help brands stand out in the market. Their expertise in design, manufacturing, and distribution ensures high-quality products that meet the needs of their clients.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Mlp U.s.a., Inc.. Retrieved from https://idiyas.com/company/mlp-u-s-a
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]