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For the Inventor, By the Inventor

Kanagawa, Japan

Micro Module Technology Co., Ltd.


USPTO Granted Patents = 3

Forward Citations = 3

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1 inventor (with patents filed for the assignee):

goldMedal Fumikazu Harazono (3 out of 10 patents)


3 patents:

1. 11380610 - Semiconductor device and method of manufacturing semiconductor device (2022-07-05),
2. 10319766 - Packaged optical device with sealing resin and method of manufacturing packaged optical device (2019-06-11),
3. 9159715 - Miniaturized semiconductor device (2015-10-13),
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USPTO Data Jan 1 1976 - Jan 6 2026

3 Patents

#281 in Kanagawa

#8,771 in Japan

...
Kanagawa, Japan

Micro Module Technology Co., Ltd.

Forward Citations = 3

1 inventor:

goldMedal Fumikazu Harazono (3 out of 10 patents)

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