The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2015
Filed:
Aug. 30, 2013
Applicant:
Micro Module Technology Co., Ltd., Yokohama-shi, Kanagawa, JP;
Inventor:
Fumikazu Harazono, Yokohama, JP;
Assignee:
Micro Module Technology Co., Ltd., Yokohama-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/528 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/3107 (2013.01); H01L 23/3675 (2013.01); H01L 23/528 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 29/7827 (2013.01); H01L 29/861 (2013.01);
Abstract
To realize further miniaturization of a semiconductor device. The semiconductor deviceis provided with a switching element (FET) provided on a substrate, a first electrode (electrode) provided on an opposite side of the substrateinterposing the switching element, a diodeprovided on an opposite side of the switching element interposing the first electrode, and a second electrode (electrode) provided on an opposite side of the first electrode interposing the diode