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For the Inventor, By the Inventor

Hsinchu, Taiwan

Mecic Corporation


USPTO Granted Patents = 1

Forward Citations = 51

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1 inventor (with patents filed for the assignee):

goldMedal Mou-Shiung Lin (1 out of 363 patents)


1 patent:

1. 6350705 - Wafer scale packaging scheme (2002-02-26),
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USPTO Data Jan 1 1976 - Sep 15 2026

1 Patents

#751 in Hsinchu

#6,150 in Taiwan

Hsinchu, TW
Hsinchu, Taiwan

Mecic Corporation

Forward Citations = 51

1 inventor:

goldMedal Mou-Shiung Lin (1 out of 363 patents)

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