% Expired Patents = 10.0

Forward Citations = 39

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3 inventors (with patents filed for the assignee):

Donald C Sedberry (10 out of 10 patents)

Derek Rollins (3 out of 6 patents)

David S Metzger (3 out of 3 patents)

10 patents: Sort by Forward Citations

1. 8371241 - Method and apparatus for applying electronic circuits to curved surfaces (2013-02-12),

2. 8056474 - Apparatus for applying electronic circuits to curved surfaces (2011-11-15),

3. 7743702 - Method for applying electronic circuits to curved surfaces (2010-06-29),

4. 6553662 - Method of making a high-density electronic circuit (2003-04-29),

5. 5624708 - High-density circuit and method of its manufacture (1997-04-29),

6. 5488394 - Print head and method of making same (1996-01-30),

7. 5416502 - High-density circuit and method of its manufacture (1995-05-16),

8. 5317342 - High-density print head (1994-05-31),

9. 5162191 - High-density circuit and method of its manufacture (1992-11-10),

10. 4897676 - High-density circuit and method of its manufacture (1990-01-30),

Company Overview

Max Levy Autograph, Inc. is a prominent manufacturer specializing in precision components and systems for various industries, including aerospace, automotive, and medical devices. The company is known for its expertise in advanced manufacturing techniques, particularly in the areas of microfabrication and precision machining. Based in Philadelphia, PA, Max Levy Autograph focuses on delivering high-quality solutions that meet the stringent requirements of its clients, leveraging innovative technologies to enhance product performance and reliability.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

10 Patents

#99 in Philadelphia, PA

#1,084 in Pennsylvania

#29,866 in US

#56,047 in the World

Philadelphia, PA, United States of America

Max Levy Autograph, Inc.

Forward Citations = 39

3 inventors:

Donald C Sedberry (10 out of 10 patents)

Derek Rollins (3 out of 6 patents)

David S Metzger (3 out of 3 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Max Levy Autograph, Inc.. Retrieved from https://idiyas.com/company/max-levy-autograph

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]