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USPTO Data Jan 1 1976 - Oct 20 2026
10 Patents
#22 in Boulogne-Billancourt
#1,711 in France
#56,092 in the World
Le Material Telephonique
Forward Citations = 65
20 inventors:
Le Material Telephonique
Forward Citations = 65
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20 inventors (with patents filed for the assignee):
Bernard M Depouilly (2 out of 3 patents)
Edouard M Issenmann (2 out of 2 patents)
Jean-Paul Lager (2 out of 3 patents)
4. Pierre Leon Lecuyer (1 out of 1 patent)
5. Francois Crousillac (1 out of 1 patent)
6. Jean P Lager (1 out of 1 patent)
7. Jean C Ledey (1 out of 1 patent)
8. Jean P Le Pabic (1 out of 1 patent)
9. Jacques R Granet (1 out of 1 patent)
10. Jean-Pierre Le Pabic (1 out of 1 patent)
11. Jean-Louis Y Moreau (1 out of 1 patent)
12. Marc P Dieudonne (1 out of 4 patents)
13. Claude M Villemant (1 out of 1 patent)
14. Renee Quintin (1 out of 1 patent)
15. Hieu K Nguyen (1 out of 1 patent)
10 patents:
Company Overview
Le Material Telephonique is a French company based in Boulogne-Billancourt, specializing in the development and manufacturing of innovative telecommunication solutions. The organization focuses on enhancing connectivity through advanced materials and technologies, catering to both consumer and industrial markets. With a commitment to research and development, Le Material Telephonique aims to push the boundaries of communication technology, ensuring reliable and efficient connectivity across various applications.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Le Material Telephonique. Retrieved from https://idiyas.com/company/le-material-telephonique
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]