For the Inventor, By the Inventor

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Tokyo-to, Japan

Kasai Koyco Co., Ltd

USPTO Granted Patents = 1

Forward Citations = 7

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2 inventors (with patents filed for the assignee):

Masahiko Hara (1 out of 15 patents)

Tetsuyuki Ota (1 out of 3 patents)

1 patent: Sort by Forward Citations

1. 5776509 - Die assembly device for molding laminated assemblies (1998-07-07),

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USPTO Data Jan 1 1976 - Dec 16 2025

1 Patents

#33 in Tokyo-to

#15,539 in Japan

Tokyo-to, Japan

Kasai Koyco Co., Ltd

Forward Citations = 7

2 inventors:

Masahiko Hara (1 out of 15 patents)

Tetsuyuki Ota (1 out of 3 patents)

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