The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1998
Filed:
Mar. 27, 1996
Tetsuyuki Ota, Kanagawa-ken, JP;
Masahiko Hara, Kanagawa-ken, JP;
Kasai Koyco Co., Ltd, Tokyo-to, JP;
Abstract
In a method and die assembly device for molding a laminated assembly comprising a resin core member and a surface skin member covering a part of the surface of the resin core member, the shifting and creasing of the surface skin member is avoided, the molding precision is increased during the mold press forming process, and the external appearance of the assembly is improved. By providing an outer peripheral groove in the die surface of the upper die for mold press forming along the outer periphery of the cavity of the upper die, and relatively large vacuum suction holes in this outer peripheral groove while providing relatively small vacuum suction holes inside the cavity, in particular in recessed parts thereof corresponding to the corners of the product, the surface skin member can be retained to the upper die when mounting the surface skin member on the upper die in both secure and well sealed manner so that the surface skin member would not shift or crease during the mold press forming process, and, therefore, the molding precision can be improved.