For the Inventor, By the Inventor

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Boise, ID, United States of America

Jst Manufacturing, Inc.

USPTO Granted Patents = 1

Forward Citations = 0

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4 inventors (with patents filed for the assignee):

David Campion (1 out of 2 patents)

Jason Boyd (1 out of 2 patents)

Travis Deleve (1 out of 2 patents)

4. Jacob Stafford (1 out of 1 patent)

1 patent: Sort by Forward Citations

1. 9349602 - Semiconductor wafer chuck and method (2016-05-24),

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USPTO Data Jan 1 1976 - Dec 30 2025

1 Patents

#157 in Boise, ID

#460 in Idaho

#133,892 in US

Boise, ID, United States of America

Jst Manufacturing, Inc.

Forward Citations = 0

4 inventors:

David Campion (1 out of 2 patents)

Jason Boyd (1 out of 2 patents)

Travis Deleve (1 out of 2 patents)

4. Jacob Stafford (1 out of 1 patent)

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