For the Inventor, By the Inventor

Enter assignee name

Alleroed, Denmark

Hymite A/s

USPTO Granted Patents = 26

EPO Patents = 1

Forward Citations = 464

Loading Chart...

Loading Chart...

13 inventors (with patents filed for the assignee):

Matthias Heschel (10 out of 12 patents)

Arnd Kilian (7 out of 16 patents)

Lior Shiv (6 out of 7 patents)

4. Kristian Blidegn (5 out of 5 patents)

5. Ralf Hauffe (3 out of 3 patents)

6. Jochen Kuhmann (2 out of 11 patents)

7. Thomas Murphy (2 out of 5 patents)

8. Jorgen Hoeg (2 out of 2 patents)

9. Jochen Friedrich Kuhmann (2 out of 6 patents)

10. Steen Weichel (1 out of 1 patent)

11. Marcus Winter (1 out of 1 patent)

12. Mogens Rysholt Poulsen (1 out of 1 patent)

13. Christoffer Graae Greisen (1 out of 4 patents)

26 patents: Sort by Forward Citations

1. 7732829 - Optoelectronic device submount (2010-06-08),

2. 7732240 - Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane (2010-06-08),

3. 7732234 - Fabrication process for package with light emitting device on a sub-mount (2010-06-08),

4. 7681306 - Method of forming an assembly to house one or more micro components (2010-03-23),

5. 7662710 - Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane (2010-02-16),

6. 7553695 - Method of fabricating a package for a micro component (2009-06-30),

7. 7543999 - Optical module hermetically packaged in micro-machined structures (2009-06-09),

8. 7531445 - Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane (2009-05-12),

9. 7528422 - Package for a light emitting element with integrated electrostatic discharge protection (2009-05-05),

10. 7470622 - Fabrication and use of polished silicon micro-mirrors (2008-12-30),

11. 7467897 - Light transmitting modules with optical power monitoring (2008-12-23),

12. 7419853 - Method of fabrication for chip scale package for a micro component (2008-09-02),

13. 7415180 - Accurate positioning of components of an optical assembly (2008-08-19),

14. 7388285 - Hermetically sealed package for optical, electronic, opto-electronic and other devices (2008-06-17),

15. 7253388 - Assembly with self-alignment features to position a cover on a substrate that supports a micro component (2007-08-07),

Hymite A/S is a leading provider of advanced electronic components and solutions. With over 20 years of experience in the industry, Hymite specializes in the design, production, and distribution of high-quality semiconductor products. Our innovative solutions cater to various sectors including telecommunications, automotive, industrial, and consumer electronics. We are committed to delivering reliable, efficient, and cost-effective solutions to meet the evolving needs of our global clientele.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

26 Patents

#1 in Alleroed

#117 in Denmark

#24,040 in the World

Alleroed, Denmark

Hymite A/s

Forward Citations = 464

13 inventors:

Matthias Heschel (10 out of 12 patents)

Arnd Kilian (7 out of 16 patents)

Lior Shiv (6 out of 7 patents)

4. Kristian Blidegn (5 out of 5 patents)

5. Ralf Hauffe (3 out of 3 patents)

Please report any incorrect information to support@idiyas.com

Loading…