Forward Citations = 57

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6 inventors (with patents filed for the assignee):

Hiroshi Shimizu (12 out of 67 patents)

Akiyoshi Kobayashi (11 out of 21 patents)

Shigeyuki Fujii (11 out of 15 patents)

4. Takafumi Sameshima (11 out of 16 patents)

5. Yoshio Iizuka (1 out of 2 patents)

6. Kaho Osada (1 out of 4 patents)

12 patents: Sort by Forward Citations

1. 12403628 - Kneading method for use with kneading apparatus with first and second extruders (2025-09-02),

2. 11820062 - Extrusion methods wherein material is guided through a passage crossing over between adjacent cylindrical bodies (2023-11-21),

3. 11752682 - Extruder screw having paths within the screw, extruder, and extrusion method (2023-09-12),

4. 11584830 - Production method for conductive composite material (2023-02-21),

5. 11565440 - Kneading apparatus with first and second extruders (2023-01-31),

6. 11400633 - Extruder screw passages, extruder and extrusion method (2022-08-02),

7. 11400632 - Extruder screw with conveying portions and barrier portions and extrusion methods using the extruder screw and a plurality of barrel blocks (2022-08-02),

8. 11224991 - Extruder screw having paths within the screw, extruder, and extrusion method (2022-01-18),

9. 11220022 - Extruder screw having paths within the screw, extruder, and extrusion method (2022-01-11),

10. 11072104 - Screw for extruder comprising a passage crossing over between adjacent cylindrical bodies (2021-07-27),

11. 10967554 - Extruder screw having paths within the screw, extruder, and extrusion method (2021-04-06),

12. 9688001 - Method of manufacturing transparent resin composition (2017-06-27),

Company Overview

Hsp Technologies Inc. is a Japanese company based in Tsukuba, specializing in advanced technology solutions and innovative product development. The organization focuses on fields such as semiconductor technology, precision machinery, and materials science, contributing to various industries including electronics and manufacturing. Hsp Technologies is committed to research and development, aiming to enhance technological capabilities and drive progress in its specialized domains.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

12 Patents

#6 in Tsukuba

#3,935 in Japan

#48,163 in the World

Tsukuba, Japan

Hsp Technologies Inc.

Forward Citations = 57

6 inventors:

Hiroshi Shimizu (12 out of 67 patents)

Akiyoshi Kobayashi (11 out of 21 patents)

Shigeyuki Fujii (11 out of 15 patents)

4. Takafumi Sameshima (11 out of 16 patents)

5. Yoshio Iizuka (1 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hsp Technologies Inc.. Retrieved from https://idiyas.com/company/hsp-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]