Forward Citations = 0

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3 inventors (with patents filed for the assignee):

Hao-Wei Fong (1 out of 1 patent)

Ming-Goo Chien (1 out of 8 patents)

Chia-Yu Wu (1 out of 5 patents)

1 patent: Sort by Forward Citations

1. 11369049 - Electromagnetic shielding element, and transmission line assembly and electronic structure package using the same (2022-06-21),

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USPTO Data Jan 1 1976 - Oct 20 2026

1 Patents

#475 in Taoyuan

#6,134 in Taiwan

Taoyuan, Taiwan

Hotek Material Technology Co., Ltd.

Forward Citations = 0

3 inventors:

Hao-Wei Fong (1 out of 1 patent)

Ming-Goo Chien (1 out of 8 patents)

Chia-Yu Wu (1 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hotek Material Technology Co., Ltd.. Retrieved from https://idiyas.com/company/hotek-material-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]