Company Badge
USPTO Data Jan 1 1976 - Oct 13 2026
28 Patents
#50 in Saint Paul, MN
#346 in Minnesota
#12,013 in US
#23,285 in the World
Hoerner Waldorf Corporation
Forward Citations = 520
22 inventors:
Saint Paul, MN, United States of America
Hoerner Waldorf Corporation
Forward Citations = 520
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22 inventors (with patents filed for the assignee):
Harry I Roccaforte (8 out of 94 patents)
Robert A Bliss (2 out of 5 patents)
Jack C Gorham (2 out of 3 patents)
4. Edwin C McLaren (2 out of 14 patents)
5. Rudolph A Faller (2 out of 15 patents)
6. John F Sorenson (2 out of 8 patents)
7. Herbert L Lambert (1 out of 5 patents)
8. John T Bode (1 out of 1 patent)
9. Howard R Schneider (1 out of 1 patent)
10. Jack F Kellerman (1 out of 1 patent)
11. Raymond S Dick (1 out of 1 patent)
12. David H Anenson (1 out of 1 patent)
13. Thomas B Dempster (1 out of 4 patents)
14. Lawrence H Knoell (1 out of 1 patent)
15. William M Tolaas (1 out of 1 patent)
Core Competencies:
Carton Closure
Recloseable Carton
Pour Spout
Dispensing Package
Die Cut Container
Taco Package
Visual Display Packages
Carton Sealing
Carrying Carton
Loin Box
Tape Cassette Hub
Sink Packages
28 patents:
Company Overview
Hoerner Waldorf Corporation, based in Saint Paul, MN, specializes in the development and manufacturing of advanced packaging solutions. The company focuses on creating innovative products that cater to various industries, including food and beverage, pharmaceuticals, and consumer goods. With a commitment to sustainability and efficiency, Hoerner Waldorf leverages cutting-edge technology to enhance packaging performance while minimizing environmental impact, positioning itself as a leader in the packaging sector.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Hoerner Waldorf Corporation. Retrieved from https://idiyas.com/company/hoerner-waldorf
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]