Company Badge
USPTO Data Jan 1 1976 - Oct 20 2026
13 Patents
#48 in Dayton, OH
#1,008 in Ohio
#23,854 in US
#45,081 in the World
Heidelberg Finishing Systems, Inc.
Forward Citations = 51
16 inventors:
Dayton, OH, United States of America
Heidelberg Finishing Systems, Inc.
Forward Citations = 51
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16 inventors (with patents filed for the assignee):
Andrew L Klopfenstein (3 out of 9 patents)
Richard B Hawkes (2 out of 24 patents)
James R Schlough (2 out of 17 patents)
4. John Lawrence Herman (1 out of 10 patents)
5. Charles Jeffrey Conner (1 out of 4 patents)
6. David Upton Johnson (1 out of 2 patents)
7. Andrew D Bruce (1 out of 5 patents)
8. Stephen R Kleinhen (1 out of 6 patents)
9. Aaron J Belvo (1 out of 3 patents)
10. Richard D Wamsley (1 out of 3 patents)
11. Michael C Buschhaus (1 out of 3 patents)
12. Darryl W Coy (1 out of 1 patent)
13. James D Johnstone (1 out of 1 patent)
14. Horng J Yang (1 out of 1 patent)
15. Douglas P Loughman (1 out of 1 patent)
13 patents:
Company Overview
Heidelberg Finishing Systems, Inc., based in Dayton, Ohio, specializes in advanced finishing solutions for the printing industry. The company focuses on developing innovative technologies that enhance the efficiency and quality of print production processes. Its product offerings include a range of finishing equipment designed to meet the diverse needs of commercial printers, packaging manufacturers, and other related sectors. With a commitment to precision and reliability, Heidelberg Finishing Systems plays a vital role in the evolution of print finishing technologies.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Heidelberg Finishing Systems, Inc.. Retrieved from https://idiyas.com/company/heidelberg-finishing-systems
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]