Trademarks = 1

Forward Citations = 44

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10 inventors (with patents filed for the assignee):

Patrick Mueller (2 out of 2 patents)

Maik Winderlich (2 out of 2 patents)

Thorsten Wisnia (2 out of 2 patents)

4. Bjoern Mueller (2 out of 2 patents)

5. Ralf Rottmann (1 out of 9 patents)

6. Andreas Boehmer (1 out of 1 patent)

7. Andreas Böhmer (1 out of 1 patent)

8. Volker Flesch (1 out of 1 patent)

9. Andre Clemens (1 out of 1 patent)

10. Marvin Berger (1 out of 1 patent)

6 patents: Sort by Forward Citations

1. 12539821 - Vehicle bumper assembly (2026-02-03),

2. 12163200 - Shield for heat treating a plate workpiece (2024-12-10),

3. 12090938 - Motor-vehicle bumper assembly (2024-09-17),

4. 11981971 - Method and apparatus for cooling a tool (2024-05-14),

5. 11721866 - Rectangular housing (2023-08-08),

6. D841589 - Housings for electric conductors (2019-02-26),

Company Overview

Gedia Gebrueder Dingerkus GmbH is a leading global supplier of high-quality metal components for the automotive industry. With over 100 years of experience, Gedia specializes in complex stamping and forming technologies, providing innovative solutions to meet the demanding requirements of the automotive sector. The company is committed to delivering top-notch products and services to its customers worldwide.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

6 Patents

#7 in Attendorn

#5,405 in Germany

Attendorn, Germany

Gedia Gebrueder Dingerkus Gmbh

Forward Citations = 44

10 inventors:

Patrick Mueller (2 out of 2 patents)

Maik Winderlich (2 out of 2 patents)

Thorsten Wisnia (2 out of 2 patents)

4. Bjoern Mueller (2 out of 2 patents)

5. Ralf Rottmann (1 out of 9 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Gedia Gebrueder Dingerkus Gmbh. Retrieved from https://idiyas.com/company/gedia-gebrueder-dingerkus

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]