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For the Inventor, By the Inventor

Ann Arbor, MI, United States of America

Epack, Inc.


USPTO Granted Patents = 3

Forward Citations = 7

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7 inventors (with patents filed for the assignee):

goldMedal Jay Mitchell (3 out of 5 patents)

silverMedal Onnop Srivannavit (2 out of 5 patents)

bronzeMedal Sangwoo Lee (2 out of 5 patents)

4.  Anthony Challoner (1 out of 9 patents)

5.  Khalil Najafi (1 out of 52 patents)

6.  Sang Woo Lee (1 out of 5 patents)

7.  Sang-Hyun Lee (1 out of 4 patents)


3 patents:

1. 10611628 - MEMS isolation platform with three-dimensional vibration and stress isolation (2020-04-07),
2. 10386385 - System with oven control and compensation for detecting motion and/or orientation (2019-08-20),
3. 10266392 - Environment-resistant module, micropackage and methods of manufacturing same (2019-04-23),
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USPTO Data Jan 1 1976 - Dec 9 2025

3 Patents

#195 in Ann Arbor, MI

#2,443 in Michigan

#71,968 in US

...
Ann Arbor, MI, United States of America

Epack, Inc.

Forward Citations = 7

7 inventors:

goldMedal Jay Mitchell (3 out of 5 patents)

silverMedal Onnop Srivannavit (2 out of 5 patents)

bronzeMedal Sangwoo Lee (2 out of 5 patents)

4.  Anthony Challoner (1 out of 9 patents)

5.  Khalil Najafi (1 out of 52 patents)

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