For the Inventor, By the Inventor

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Ann Arbor, MI, United States of America

Epack, Inc.

USPTO Granted Patents = 3

Forward Citations = 9

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7 inventors (with patents filed for the assignee):

Jay Mitchell (3 out of 5 patents)

Onnop Srivannavit (2 out of 5 patents)

Sangwoo Lee (2 out of 5 patents)

4. Anthony Challoner (1 out of 11 patents)

5. Khalil Najafi (1 out of 53 patents)

6. Sang Woo Lee (1 out of 5 patents)

7. Sang-Hyun Lee (1 out of 4 patents)

3 patents: Sort by Forward Citations

1. 10611628 - MEMS isolation platform with three-dimensional vibration and stress isolation (2020-04-07),

2. 10386385 - System with oven control and compensation for detecting motion and/or orientation (2019-08-20),

3. 10266392 - Environment-resistant module, micropackage and methods of manufacturing same (2019-04-23),

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USPTO Data Jan 1 1976 - Sep 29 2026

3 Patents

#192 in Ann Arbor, MI

#2,489 in Michigan

#73,766 in US

Ann Arbor, MI, United States of America

Epack, Inc.

Forward Citations = 9

7 inventors:

Jay Mitchell (3 out of 5 patents)

Onnop Srivannavit (2 out of 5 patents)

Sangwoo Lee (2 out of 5 patents)

4. Anthony Challoner (1 out of 11 patents)

5. Khalil Najafi (1 out of 53 patents)

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