CIPO Patents = 1

EPO Patents = 4

Trademarks = 2

Forward Citations = 4

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3 inventors (with patents filed for the assignee):

Paul M Ducker (4 out of 11 patents)

Steven S Harlen (2 out of 2 patents)

David S Varney (1 out of 1 patent)

4. Ching-Yun Morris Yang (21 patents)

5. Harry J Chmielewski (10 patents)

4 patents: Sort by Forward Citations

1. 11432969 - Ultra thin laminate with particulates in dense packages (2022-09-06),

2. 10813799 - Layered absorbent structure with wicking performance (2020-10-27),

3. 10806643 - Absorbent laminate with multiple substrates (2020-10-20),

4. 8202609 - Absorbent material with wet strength containing wax (2012-06-19),

Company Overview

EAM Corporation is a leading provider of innovative IT solutions for businesses. With a focus on cutting-edge technology and personalized service, we help our clients streamline operations, increase efficiency, and drive growth. Our expertise includes software development, data management, and cybersecurity solutions. Visit our website to learn more about how EAM Corporation can help your business succeed.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

4 Patents

#2 in Jesup, GA

#1,161 in Georgia

#60,671 in US

Jesup, GA, United States of America

Eam Corporation

Forward Citations = 4

3 inventors:

Paul M Ducker (4 out of 11 patents)

Steven S Harlen (2 out of 2 patents)

David S Varney (1 out of 1 patent)

4. Ching-Yun Morris Yang (21 patents)

5. Harry J Chmielewski (10 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Eam Corporation. Retrieved from https://idiyas.com/company/eam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent (CIPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

4 patents (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]