EPO Patents = 2

Forward Citations = 2

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2 inventors (with patents filed for the assignee):

Richard B Brown (4 out of 21 patents)

Ondrej Novak (4 out of 5 patents)

4 patents: Sort by Forward Citations

1. 11674924 - Sensor with a membrane having full circumferential adhesion (2023-06-13),

2. 11331664 - Microfluidics chip with sensor die clamping structures (2022-05-17),

3. 10464063 - Microfluidics chip with sensor die clamping structures (2019-11-05),

4. 10359391 - Sensor with a membrane having full circumferential adhesion (2019-07-23),

E-Sens, Inc. is a leading provider of smart sensor solutions for various industries, including automotive, healthcare, and consumer electronics. Our innovative sensors are designed to improve efficiency, accuracy, and performance in a wide range of applications. With extensive experience in sensor technology and data analytics, we are committed to delivering cutting-edge solutions that meet the evolving needs of our customers.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

4 Patents

#283 in Salt Lake City, UT

#749 in Utah

#58,997 in US

Salt Lake City, UT, United States of America

E-sens, Inc.

Forward Citations = 2

2 inventors:

Richard B Brown (4 out of 21 patents)

Ondrej Novak (4 out of 5 patents)

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2 patents (EPO):

Please report any incorrect information to support@idiyas.com