EPO Patents = 1

Forward Citations = 35

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4 inventors (with patents filed for the assignee):

Charles N Elsbree (2 out of 2 patents)

William H Baylis (1 out of 8 patents)

John E Tyler (1 out of 1 patent)

4. James R Turner (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 7262115 - Method and apparatus for breaking semiconductor wafers (2007-08-28),

2. 5820006 - Apparatus for scribing and/or breaking semiconductor wafers (1998-10-13),

3. 5702492 - Semiconductor wafer hubbed saw blade and process for manufacture of (1997-12-30),

4. 5588419 - Semiconductor wafer hubbed saw blade (1996-12-31),

Company Overview

Dynatex International is a global leader in providing innovative solutions for industrial sealing and bonding. With decades of experience, Dynatex specializes in manufacturing adhesives, sealants, and coatings for various industries such as automotive, aerospace, and construction. Their high-quality products are trusted by clients worldwide for their reliability and performance.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

4 Patents

#51 in Santa Rosa, CA

#14,041 in California

#60,597 in US

Santa Rosa, CA, United States of America

Dynatex International

Forward Citations = 35

4 inventors:

Charles N Elsbree (2 out of 2 patents)

William H Baylis (1 out of 8 patents)

John E Tyler (1 out of 1 patent)

4. James R Turner (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Dynatex International. Retrieved from https://idiyas.com/company/dynatex-international

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]