Taichung, Taiwan

Durq Machinery Corp.


USPTO Granted Patents = 37

% Expired Patents = 18.9

Trademarks = 3

Forward Citations = 579

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14 inventors (with patents filed for the assignee):

goldMedal Chia-Sheng Liu (23 out of 28 patents)

silverMedal Peter Huang (10 out of 16 patents)

bronzeMedal Yu-Feng Chan (6 out of 7 patents)

4.  Chen-Yuan Chen (4 out of 4 patents)

5.  Chieh-Yuan Tsai (4 out of 5 patents)

6.  Yu-Chia Huang (4 out of 4 patents)

7.  Yi-Li Cheng (3 out of 3 patents)

8.  Ming-Feng Liao (2 out of 2 patents)

9.  Fu-peng Chou (2 out of 2 patents)

10.  Wen-Hung Lo (1 out of 1 patent)

11.  Chien-Chang Lin (1 out of 3 patents)

12.  Fu-Peng Chou (1 out of 2 patents)

13.  Yuan-Chih Ting (1 out of 2 patents)

14.  Hin-Hsien Wu (1 out of 1 patent)


Core Competencies:
Mowing Robot
Positioning System
Safety Module
Circular Saw
Cutting Machine
Folding Mechanism
Worktable
Quick Release Structure
Mobile Stand
Dustproof Assembly
Adjustable Worktable
Saw Blade Guard

37 patents:

Company Overview
Durq Machinery Corp. is a prominent manufacturer based in Taichung, Taiwan, specializing in advanced machinery solutions. The company focuses on the development of precision equipment and innovative manufacturing technologies, catering to various industries including automotive, aerospace, and electronics. With a commitment to quality and efficiency, Durq Machinery aims to enhance production processes and deliver reliable machinery that meets the evolving demands of global markets.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

37 Patents

#54 in Taichung

#513 in Taiwan

#18,260 in the World

Taichung, TW
Taichung, Taiwan
Forward Citations = 579

14 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Durq Machinery Corp.. Retrieved from https://idiyas.com/company/durq-machinery

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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