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For the Inventor, By the Inventor

Allentown, PA, United States of America

Cenix, Inc.


USPTO Granted Patents = 1

% Expired Patents = 100.0

Forward Citations = 10

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1 inventor (with patents filed for the assignee):

goldMedal Bongsin Kwark (1 out of 2 patents)


1 patent:

1. 6602078 - Electrical interconnect having a multi-layer circuit board structure and including a conductive spacer for impedance matching (2003-08-05),
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USPTO Data Jan 1 1976 - Sep 29 2026

1 Patents

#88 in Allentown, PA

#4,965 in Pennsylvania

#136,730 in US

Allentown, PA (US)
Allentown, PA, United States of America

Cenix, Inc.

Forward Citations = 10

1 inventor:

goldMedal Bongsin Kwark (1 out of 2 patents)

Please report any incorrect information to [email protected]
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