EPO Patents = 1

Forward Citations = 1,371

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3 inventors (with patents filed for the assignee):

Harry J Tiffany, Iii (4 out of 7 patents)

Paul W Reed (2 out of 13 patents)

Paul Reed (0 patent)

6 patents: Sort by Forward Citations

1. 8012809 - Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces (2011-09-06),

2. 7225537 - Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces (2007-06-05),

3. 6256873 - Method for making smart cards using isotropic thermoset adhesive materials (2001-07-10),

4. 6241153 - Method for making tamper-preventing, contact-type, smart cards (2001-06-05),

5. 6025054 - Smart cards having glue-positioned electronic components (2000-02-15),

6. 5955021 - Method of making smart cards (1999-09-21),

Cardxx, Inc. is a leading provider of smart card technology solutions. With a focus on high-quality, secure card products, Cardxx offers a wide range of solutions for businesses and organizations seeking to enhance their security and convenience. From contactless smart cards to biometric solutions, Cardxx is dedicated to delivering cutting-edge technology to meet the needs of today's rapidly evolving market.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

6 Patents

#79 in Englewood, CO

#956 in Colorado

#43,729 in US

Englewood, CO, United States of America

Cardxx, Inc.

Forward Citations = 1,371

3 inventors:

Harry J Tiffany, Iii (4 out of 7 patents)

Paul W Reed (2 out of 13 patents)

Paul Reed (0 patent)

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1 patent (EPO):

Please report any incorrect information to support@idiyas.com