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For the Inventor, By the Inventor

Taipei, Taiwan

Andaq Technology Co., Ltd.


USPTO Granted Patents = 3

Forward Citations = 2

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2 inventors (with patents filed for the assignee):

goldMedal Chia-Yu Wu (2 out of 5 patents)

silverMedal Ching-Feng Lin (1 out of 23 patents)


3 patents:

1. 10950390 - Stacked type capacitor without carbon paste layer, manufacturing method thereof and silver paste layer (2021-03-16),
2. 10923289 - Stacked type capacitor package structure without carbon paste layer, stacked type capacitor thereof, and polymer composite layer (2021-02-16),
3. 10098268 - Electromagnetic wave shielding tape using nanomaterials (2018-10-09),
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USPTO Data Jan 1 1976 - Dec 9 2025

3 Patents

#1,114 in Taipei

#3,190 in Taiwan

...
Taipei, Taiwan

Andaq Technology Co., Ltd.

Forward Citations = 2

2 inventors:

goldMedal Chia-Yu Wu (2 out of 5 patents)

silverMedal Ching-Feng Lin (1 out of 23 patents)

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