Trademarks = 1

Forward Citations = 144

Loading Chart...

4 inventors (with patents filed for the assignee):

Jeremy D Scherer (3 out of 9 patents)

Manuel Medeiros, Iii (2 out of 4 patents)

Jay S Greenspan (2 out of 6 patents)

4. Steven A Tower (1 out of 1 patent)

5 patents: Sort by Forward Citations

1. 5188985 - Surface mount device with high thermal conductivity (1993-02-23),

2. 5111277 - Surface mount device with high thermal conductivity (1992-05-05),

3. 4768077 - Lead frame having non-conductive tie-bar for use in integrated circuit (1988-08-30),

4. 4649229 - All metal flat package for microcircuitry (1987-03-10),

5. 4633573 - Microcircuit package and sealing method (1987-01-06),

Aegis, Inc. is a leading provider of customer service and business process outsourcing solutions. With over 30 years of experience, we specialize in delivering exceptional customer experiences and driving operational efficiencies for our clients. Our services include inbound and outbound customer support, technical support, sales and retention, and back-office processes. We are committed to providing innovative solutions and exceeding customer expectations.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

5 Patents

#10 in New Bedford, MA

#2,887 in Massachusetts

#51,493 in US

New Bedford, MA, United States of America

Aegis, Inc.

Forward Citations = 144

4 inventors:

Jeremy D Scherer (3 out of 9 patents)

Manuel Medeiros, Iii (2 out of 4 patents)

Jay S Greenspan (2 out of 6 patents)

4. Steven A Tower (1 out of 1 patent)

Please report any incorrect information to [email protected]