Recognizing Inventors with Centurion+ Utility, Design and Plant Patents as of November 21, 2023

Welcome to the 21st of November 2023: Our goal is to celebrate the pioneering recognizing inventors who have reached noteworthy milestones in their fields this week.

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Jeongki Kim

Wireless system (Wi-Fi, cellular) standard technologies expert.

Jeongki Kim has been a senior technical staff at Ofinno, LLC. He was a research engineer of ACS Laboratory at LG Electronics company, from January 2005 to May 2021.

He has been researching the PHY technologies in several Wireless Communication Systems, developing new standard technologies in those areas, and being to draft the developed standard technologies in the related specifications.

Jeongki is currently focusing on developing new Wi-Fi standard technologies.

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Patent №: 11825405 (November 21, 2023) – Method and device for requesting partial information from APs within transmission MLD in wireless LAN system.

This patent proposes a method and device for obtaining partial information from access points (APs) within a transmission Media Load (MLD) in a wireless LAN (WLAN) system. By transmitting probe request frames and receiving probe response frames, partial information regarding each link is utilized to streamline network communication efficiently.

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Stephen William Edge

Technologies Principal Engineer at Qualcomm.

Originally from England, Stephen attended Cambridge University, where he studied math and electrical engineering. He later earned a PhD in Computer Science from University College London, where he specialized in packet switching networks.

Mr. Edge also ran simulations of the early TCP/IP protocol for ARPANET — the predecessor of the modern internet. Since joining Qualcomm in 2005, Stephen’s work has focused on inventing the technological foundations of location services, as well as coordinating standardization efforts for 5G satellite communications.

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Patent №: 11824625 (November 21, 2023) – Systems and methods for handover of mobile devices, radio cells and space vehicles for mobile satellite wireless access. This patent introduces innovative techniques to facilitate access, mobility management, and regulatory services in satellite access to a 5G core network (5GCN). The patent details a seamless handover approach between radio cells and earth stations, ensuring uninterrupted connectivity for users.

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Patent №: 11825441 (November 21, 2023) – Navigation and positioning system using radio beam support information. This patent focuses on optimizing location determination operations in mobile devices by obtaining beam support information from multiple cells. By performing measurements based on this information, Edge enables accurate and efficient positioning capabilities.

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Eng Huat Toh

Principal Member of Technical Staff (Deputy Director) at GLOBALFOUNDRIES.

He received his Ph.D. degree from the National University of Singapore (NUS). His research interests include novel semiconductor devices, next-generation memories, magnetic sensors, and biosensors. 

Patent №: 11821924 (November 21, 2023) – On-chip current sensor. Toh’s on-chip current sensor patent presents a semiconductor structure with a vertical Hall sensor and a current-carrying conductor in a first wiring layer. This invention enables precise and integrated current measurement for a variety of applications.

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Patent №: 11823889 (November 21, 2023) – Sensor and method of forming the same.  This patent introduces a novel sensor design incorporating a substrate with multiple semiconductor layers and a buried insulator layer. The sensor features a photodiode in the first semiconductor layer and a quenching resistive element in the second semiconductor layer. The innovative arrangement allows for efficient operation and accurate sensing capabilities.

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Javier A DeLaCruz

Fellow & Senior Director of Silicon Ops Engineering.

Patent №: 11824042 (November 21, 2023) – 3D chip sharing data bus.  This invention enables the stacking of multiple IC dies, allowing them to overlap and share interconnect layers that distribute power, clock, and data-bus signals. By utilizing higher-level interconnect layers, DeLaCruz’s design optimizes space and enhances performance, revolutionizing the field of IC technology.

Patent №: 11824046 (November 21, 2023) –Symbiotic network on layers.

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Patent №: 11823906 (November 21, 2023) – Direct-bonded native interconnects and active base die. This invention presents a microelectronic architecture that allows active chiplets to connect directly to an active base die through core-level conductors. By leveraging native interconnects, this design minimizes routing blockages and improves signal quality and timing. The system is also flexible, accommodating diverse interconnect types and chiplets from various process nodes, thereby reducing footprint and power requirements.

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Ming-Hsiu Lee

Electronic Material and Device Integration Division, Emerging Central Lab., Macronix International Co., Ltd.

Mr. Lee received his B.S. and M.S. in electrophysics from the National Chiao-Tung University in Hsinchu, Taiwan in 1991 and 1993, respectively.

He joined Macronix International (MXIC) in 1995 with works covering process integration, device characterization, product engineering, and emerging memory device R&D. His major research interests include floating gate memories, SONOS devices, 3-D memories, phase change memory, and various resistive memories

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Patent №: 11823749 (November 21, 2023) – CAM cell, CAM memory device and operation method thereof. The CAM cell he developed is a part of a CAM memory device, which offers efficient content-addressable storage and retrieval of data. By utilizing a combination of threshold voltages of parallel-coupled flash memory cells, Lee’s invention enhances the performance and efficiency of CAM cells, making them ideal for high-speed data-searching applications.

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