The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2009
Filed:
Jul. 14, 2005
Mou-shiung Lin, Hsinchu, TW;
Tah-kang Joseph Ting, Hsinchu, TW;
Mou-Shiung Lin, Hsinchu, TW;
Tah-Kang Joseph Ting, Hsinchu, TW;
Megica Corporation, Hsin-Chu, TW;
Etron Technology, Inc., Hsin-Chu, TW;
Abstract
A new method is provided for the creation of Input/Output connection points to a semiconductor device package. An extension is applied to the conventional I/O connect points of a semiconductor device, allowing the original I/O point location to be relocated to a new point of I/O interconnect that may be in the vicinity of the original point of I/O interconnect but can also be located at a distance from this original point of I/O interconnect. Layers of passivation and polyimide are provided for proper creation and protection of the extended and relocated I/O pads. Wire bonding is used to further interconnect the relocated I/O pads.